ZONESUN ZS-AGD5 Automatic AB Glue Dispensing Machine Two-Component Epoxy Resin Silicone Mixing Dispensing System

Overview

The ZONESUN ZS-AGD5 is a fully automatic two-component (A/B) glue dispensing machine designed for precise mixing and quantitative dispensing of dual-component adhesives including AB glue, epoxy resin, silicone, polyurethane, and similar two-part materials. Featuring automatic ratio control (1:1 to 1:10 adjustable), ±2% dispensing accuracy, and an automatic cleaning function to prevent glue curing in the mixing head, the ZS-AGD5 delivers stable, repeatable dispensing performance across continuous production shifts. Controlled via a user-friendly PLC system, it is widely deployed in electronics, LED products, power supplies, electrical appliances, handicrafts, and automotive parts manufacturing.

Technical Parameters

• Model: ZS-AGD5
• Glue Tank Capacity: Tank A: 20L, Tank B: 20L (customizable)
• Cleaning Tank: 1L
• Working Voltage: AC 220V, 50Hz
• Power: 700W
• Air Supply: 0.5–0.6 MPa
• Working Temperature: 5–40°C
• Working Humidity: 20–90%
• Dispensing Accuracy: ±2%
• Dispensing Speed: 1–10 g/s (adjustable)
• Glue Ratio: 1:1 to 1:10 (optional)
• Machine Dimensions: 1000 × 400 × 1450 mm (standard)
• Machine Weight: 120 kg
• Packing Dimensions: 1100 × 500 × 1160 mm
• Packing Weight: 150 kg

Key Features

• Automatic A/B Ratio Control (1:1 to 1:10): Programmable ratio control covers the full range of standard two-component adhesive mix ratios, enabling the same machine to handle different adhesive formulations without mechanical pump replacement — simply adjust the ratio parameter via the PLC interface.
• ±2% Dispensing Accuracy: Precision metering pumps maintain consistent A and B component volumes within ±2% tolerance across the full dispensing speed range, ensuring repeatable bond strength and minimizing adhesive waste on high-volume production lines.
• Automatic Cleaning Function — Anti-Curing Protection: Built-in automatic cleaning cycle flushes the mixing head and dispensing nozzle with solvent at programmable intervals, preventing two-component adhesive from curing inside the system during pauses or shift changes — eliminating manual cleaning downtime and nozzle replacement costs.
• Adjustable Dispensing Speed (1–10 g/s): Variable flow rate allows operators to match dispensing speed to substrate size, bond area, and downstream cure time requirements — from fine bead application on small electronic components to larger potting fills on power supply housings.
• Large-Capacity Dual Tanks (20L + 20L, Customizable): Standard 20-liter tanks for both A and B components support extended production runs without frequent refilling; tank size is customizable for high-volume operations requiring larger reservoirs.
• PLC Control System with User-Friendly Interface: Programmable logic controller stores multiple dispensing programs for different products, enabling rapid recipe changeover between SKUs without manual recalibration of ratio or speed settings.
• Broad Adhesive Compatibility: Handles AB glue, epoxy resin, silicone, polyurethane, and other dual-component adhesives with varying viscosities and pot lives — a single machine serves multiple adhesive types across different production applications.
• Compact Industrial Footprint (1000 × 400 × 1450 mm): Slim upright design minimizes floor space usage while accommodating full dual-tank, pump, and control system assembly — suitable for integration into existing assembly line layouts.

Applications

• Electronics & PCB Assembly: Potting and encapsulation of PCBs, connectors, sensors, and electronic modules with epoxy or polyurethane to protect against moisture, vibration, and thermal stress.
• LED Lighting Manufacturing: Dispensing of silicone or epoxy encapsulant into LED strip housings, COB modules, and LED driver assemblies for optical clarity and environmental protection.
• Power Supply & Transformer Potting: Filling of power supply enclosures and transformer housings with two-component polyurethane or epoxy for electrical insulation and heat dissipation.
• Automotive Parts Assembly: Bonding and sealing of automotive sensors, control units, lighting assemblies, and structural components requiring precise two-component adhesive application under production line conditions.
• Electrical Appliance Manufacturing: Potting of motor windings, switch assemblies, and electrical junction boxes with two-component adhesive for moisture resistance and mechanical protection.
• Handicrafts & Decorative Products: Precision AB glue dispensing for resin casting, jewelry making, decorative inlay, and craft assembly applications requiring controlled mix ratios and consistent bead placement.
• Medical Device Assembly: Bonding and sealing of medical device housings, sensor assemblies, and diagnostic equipment components with biocompatible two-component adhesives under controlled dispensing conditions.